Capabilities

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Crystal
Our Crystal and Shaping Departments are the "1st steps" of Bullen Ultrasonics (Franklin Street Facility) COMPLETE "in house" Silicon manufacturing and machining

The Crystal Department processes Amphorous / Poly Silicon into "Single" or "Dislocation Free" Crystals (diameters ranging from 50 mm to 425 mm).

The Shaping Department receives the completed Silicon Crystals and utilizes 6 major processes (Cropping, OD Grinding, Wire Slicing, Edge Grinding, Cleaning and Annealing) to "ready" the Silicon "Blanks / Wafers" for our QC or other departments. Bullen Ultrasonics owns the worlds largest (crystal diameter capabilities) Wire Saw.